The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Dec. 31, 2014
Applicant:

Airbus Operations S.l., Getafe (Madrid), ES;

Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64C 1/00 (2006.01); B64C 3/00 (2006.01); B64C 5/00 (2006.01); B64C 3/18 (2006.01); B64C 3/20 (2006.01); B64C 3/26 (2006.01); B32B 37/02 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/16 (2006.01); B32B 41/00 (2006.01); B64C 5/02 (2006.01); B64D 27/26 (2006.01); B29C 70/44 (2006.01); B29D 99/00 (2010.01); B64F 5/10 (2017.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
B64C 3/18 (2013.01); B29C 70/443 (2013.01); B29D 99/0014 (2013.01); B32B 37/02 (2013.01); B32B 37/06 (2013.01); B32B 37/1018 (2013.01); B32B 37/16 (2013.01); B32B 41/00 (2013.01); B64C 3/20 (2013.01); B64C 3/26 (2013.01); B64C 5/02 (2013.01); B64D 27/26 (2013.01); B64F 5/10 (2017.01); B32B 2038/0076 (2013.01); B32B 2038/0096 (2013.01); B32B 2309/68 (2013.01); B32B 2309/70 (2013.01); B32B 2605/18 (2013.01); B64D 2027/264 (2013.01); Y02T 50/433 (2013.01);
Abstract

Highly integrated infused box made of composite material with two skins (), several ribs (), several stringers (), a front spar and a rear spar, comprising a first semibox () and a second semibox () joined by connecting means, in which the first semibox () comprises one skin () and the ribs (), and the second semibox () comprises one skin (), the front spar, the rear spar and the stringers (). A manufacturing method is also provided, which comprises forming processes for the first semibox (), the second semibox () and an assembly process of the first semibox () with the second semibox ().


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