The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Nov. 06, 2013
Mitsubishi Heavy Industries Plastic Technology Co., Ltd., Nagoya-shi, Aichi, JP;
Toshihiko Kariya, Nagoya, JP;
Naoki Toda, Nagoya, JP;
Munehiro Nobuta, Nagoya, JP;
Kiyoshi Kinoshita, Nagoya, JP;
Takeshi Yamaguchi, Nagoya, JP;
Kosuke Ikeda, Tokyo, JP;
Yuji Suzumura, Tokyo, JP;
Hitoshi Onuma, Tokyo, JP;
Ryoji Okabe, Tokyo, JP;
Masanori Takahashi, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD., Nagoya-Shi, Aichi, JP;
Abstract
The injection molding apparatus of the present invention includes: a heating cylinder; a screw that is provided rotatably in an inner portion of the heating cylinder; a resin feed hopper that feeds a resin pellet; and a fiber feed device that is provided ahead of the resin feed hopper and feeds reinforcing fibers into the heating cylinder. The screw includes a first stage that is located on a rear side, and in which the resin pellet is melted, and a second stage that is located on a front side, and in which the melted resin pellet and the reinforcing fibers are mixed, and a lead of a second flight provided in the second stage is larger than a lead of a first flight provided in the first stage.