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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9669567 B1

PDFFull Text
Date of Patent:
Jun. 06, 2017

Filed:

Jul. 30, 2014

Manufacturing method of molded article

Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Tsuyoshi Takeda, Osaka, JP;

Hiromitsu Takashita, Osaka, JP;

Keiko Kashihara, Osaka, JP;

Shingo Yoshioka, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Galen Hauth

Int. Cl.
CPC ...
H01L 21/768 (2006.01); B29C 41/20 (2006.01); B32B 37/12 (2006.01); H01L 23/00 (2006.01); B29K 101/00 (2006.01); B29C 39/10 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B29C 41/20 (2013.01); B32B 37/12 (2013.01); H01L 21/561 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); B29C 39/10 (2013.01); B29K 2101/00 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/3511 (2013.01);
Abstract

The present invention relates to a manufacturing method of a molded article, including: a molded article forming step of forming a molded article by curing a resin composition on a main surface, on the side of a bendable first supporting medium, of a laminated supporting medium obtained by laminating the first supporting medium and a second supporting medium that is harder than the first supporting medium; a second-supporting medium peeling step of peeling the second supporting medium from the first supporting medium after the molded article forming step; and a first-supporting medium peeling step of peeling the first supporting medium from the molded article while bending the first supporting medium after the second-supporting medium peeling step. The shape of the first supporting medium can be maintained at a curing temperature at which the resin composition is cured in the molded article forming step.

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