The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9669518 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 06, 2017

Filed:

Aug. 26, 2014
Applicant:

San Fang Chemical Industry Co., Ltd., Kaohsiung, TW;

Inventors:

Chung-Chih Feng, Kaohsiung, TW;

I-Peng Yao, Kaohsiung, TW;

Wen-Chieh Wu, Kaohsiung, TW;

Yung-Chang Hung, Kaohsiung, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/32 (2006.01); B24D 11/00 (2006.01); B24B 37/24 (2012.01);
U.S. Cl.
CPC ...
B24D 3/32 (2013.01); B24B 37/24 (2013.01); B24D 11/00 (2013.01); B24D 11/001 (2013.01); B24D 11/006 (2013.01);
Abstract

The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.


Find Patent Forward Citations

Feng, Chung-Chih. (2017). Polishing pad and method for making the same (U.S. Patent No. 9669518). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9669518

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