The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Dec. 19, 2014
Applicant:
Rohde & Schwarz Gmbh & Co. KG, Munich, DE;
Inventors:
Daniel Hageneder, Boebrach, DE;
Martin Kappels, Utting, DE;
Assignee:
Rohde & Schwarz GmbH & Co. KG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); B23K 1/00 (2006.01); H01L 23/00 (2006.01); B23K 1/008 (2006.01); H01L 23/043 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); B23K 101/42 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 1/008 (2013.01); H01L 23/043 (2013.01); H01L 24/48 (2013.01); H01L 24/50 (2013.01); H01L 24/85 (2013.01); H01L 24/86 (2013.01); H05K 1/021 (2013.01); H05K 1/0243 (2013.01); H05K 1/144 (2013.01); B23K 2201/42 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/85815 (2013.01); H01L 2224/86815 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H05K 1/117 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/10409 (2013.01);
Abstract
The invention relates to a semiconductor component with a chip, especially with a high-frequency switching circuit. The semiconductor component further comprises a metal body on the chip and a supplementary circuit board. The supplementary circuit board is provided on an underside facing away from the metal body for connection with a printed-circuit board by means of reflow soldering.