The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Jan. 30, 2014
Applicant:
Taiho Kogyo Co., Ltd., Toyota-shi, Aichi, JP;
Inventors:
Hitoshi Wada, Toyota, JP;
Takashi Tomikawa, Toyota, JP;
Daisuke Yoshitome, Asahi, JP;
Hiromi Yokota, Toyota, JP;
Assignee:
TAIHO KOGYO CO., LTD., Toyota-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 9/02 (2006.01); B22F 3/10 (2006.01); B22F 1/00 (2006.01); C22C 1/04 (2006.01); C22C 9/00 (2006.01);
U.S. Cl.
CPC ...
B22F 3/10 (2013.01); B22F 1/0003 (2013.01); B22F 3/1017 (2013.01); C22C 1/0425 (2013.01); C22C 9/00 (2013.01); C22C 9/02 (2013.01); F16C 2204/12 (2013.01); F16C 2204/18 (2013.01); F16C 2360/42 (2013.01);
Abstract
Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.