The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Sep. 17, 2013
Applicants:

Boe Hyundai Lcd Inc., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Quanzhong Wang, Beijing, CN;

Zhenhua Gu, Beijing, CN;

Moyu Zhu, Beijing, CN;

Assignees:
Attorney:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 27/32 (2006.01); B05D 3/04 (2006.01); B05D 5/02 (2006.01); G09G 3/3208 (2016.01); B05D 1/26 (2006.01); B05D 1/00 (2006.01); B05D 5/10 (2006.01); B05D 3/06 (2006.01); B05D 1/02 (2006.01); C09J 9/02 (2006.01);
U.S. Cl.
CPC ...
B05D 3/0406 (2013.01); B05D 1/002 (2013.01); B05D 1/02 (2013.01); B05D 1/26 (2013.01); B05D 3/067 (2013.01); B05D 5/10 (2013.01); C09J 9/02 (2013.01); G09G 3/3208 (2013.01); H01L 27/3244 (2013.01); H01L 51/529 (2013.01); B05D 2502/00 (2013.01); B32B 2457/206 (2013.01); G09G 2300/06 (2013.01); Y10T 428/24149 (2015.01); Y10T 428/24479 (2015.01); Y10T 428/24612 (2015.01);
Abstract

A method for manufacturing a heat conductive adhesive film includes: forming a non-solid heat conductive adhesive layer with cured particles on a substrate; forming several bumps on the non-solid heat conductive adhesive layer while performing curing, so as to yield the heat conductive adhesive film with several bumps. A heat conductive adhesive film and an OLED panel are provided. Several bumps are formed on a flat surface of the heat conductive adhesive film, thus increasing the surface area of the heat conductive adhesive film such that heat from the heat generating unit can be duly discharged.


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