The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Oct. 28, 2010
Applicants:

Richard Charles Davis, Bath, GB;

Simon Richard Ford, Bath, GB;

Stephen Anthony Hall, Wells, GB;

Matthias Klaus, Strausberg, DE;

Karl-heinz Ognibeni, Kirchheimbolanden, DE;

Inventors:

Richard Charles Davis, Bath, GB;

Simon Richard Ford, Bath, GB;

Stephen Anthony Hall, Wells, GB;

Matthias Klaus, Strausberg, DE;

Karl-Heinz Ognibeni, Kirchheimbolanden, DE;

Assignee:

Sun Chemical Corporation, Parsippany, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/14 (2006.01); C09J 177/08 (2006.01); H05K 3/38 (2006.01); C08G 18/34 (2006.01); C09J 175/04 (2006.01); C09J 179/08 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); C08G 18/345 (2013.01); C08G 73/14 (2013.01); C09J 175/04 (2013.01); C09J 179/08 (2013.01); H05K 1/0393 (2013.01); H05K 3/4691 (2013.01); H05K 2201/0154 (2013.01);
Abstract

The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.


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