The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Sep. 26, 2013
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Mizuki Shirao, Tokyo, JP;

Nobuo Ohata, Tokyo, JP;

Nobuyuki Yasui, Tokyo, JP;

Hiroshi Aruga, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01P 3/00 (2006.01); H01P 3/08 (2006.01); H01P 5/02 (2006.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H01P 3/003 (2013.01); H01P 3/081 (2013.01); H01P 5/028 (2013.01); H05K 1/0251 (2013.01); H05K 1/0245 (2013.01); H05K 1/0253 (2013.01); H05K 3/363 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09727 (2013.01);
Abstract

A terminal portion configured to obtain electrical connection with a printed circuit board includes a first signal pad that is formed in a first conductor layer and is electrically separated from a ground layer, a pair of first ground pads that is formed in the first conductor layer to sandwich the first signal pad and is connected to the ground layer, a second signal pad that is formed in a second conductor layer and is connected to a signal line, a pair of second ground pads that is formed in the second conductor layer to sandwich the second signal pad and is electrically separated from the signal line, a third signal pad formed in a third conductor layer, and a pair of third ground pads formed in the third conductor layer to sandwich the third signal pad. The second signal pad is wider than the third signal pad.


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