The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Sep. 22, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Shin Hee Jun, Daejeon, KR;

Chee-Sung Park, Daejeon, KR;

Jae Hyun Kim, Daejeon, KR;

Sang Yun Jung, Daejeon, KR;

Cheol-Hee Park, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/10 (2006.01); H01B 1/22 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); H05K 1/03 (2006.01); C23C 18/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); C23C 18/161 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/1658 (2013.01); C23C 18/204 (2013.01); H01B 1/22 (2013.01); H05K 3/0014 (2013.01); H05K 3/105 (2013.01); H05K 3/181 (2013.01); H05K 3/185 (2013.01); C23C 18/405 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0236 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/107 (2013.01);
Abstract

The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern reducing deterioration of mechanical-physical properties and having excellent adhesion strength onto a variety of polymeric resin products or resin layers, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming a conductive pattern includes a polymer resin; and non-conductive metal compound particles including a first metal element and a second metal element, having a Rm or P6/mmc space group in crystal structure, and having a particle size of 0.1 to 20 μm, wherein a metal nuclei including the first metal or the second metal element or an ion thereof is formed from the non-conductive metal compound particles by electromagnetic irradiation.


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