The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Feb. 28, 2014
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Takashi Uno, Hyogo, JP;

Kazuhiro Yahata, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/66 (2006.01); H05K 7/00 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/043 (2006.01); H01L 23/047 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); H01L 23/66 (2013.01); H05K 1/18 (2013.01); H01L 23/043 (2013.01); H01L 23/047 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/49175 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30111 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10689 (2013.01);
Abstract

A semiconductor device is provided that is inexpensively manufactured with variation in high-frequency characteristics suppressed. Internal matching circuit boards are disposed on at least one signal transmission path of an input-side signal transmission path between an input terminal and a semiconductor element and an output-side signal transmission path between the semiconductor element and an output terminal and is provided for matching at least between output impedance of an external circuit connected to the input terminal and input impedance of the semiconductor device or between input impedance of an external circuit connected to the output terminal and output impedance of the semiconductor device, and components are electrically connected by at least one wire causing a change exceeding an allowable value in high-frequency characteristics of the semiconductor device due to a change in wire length and are disposed in contact with each other inside a package.


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