The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Mar. 20, 2014
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Hidetoshi Kabasawa, Kanagawa, JP;

Hiroshi Ozaki, Kanagawa, JP;

Kazuo Takahashi, Kanagawa, JP;

Satoshi Mitani, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 41/113 (2006.01); G01C 19/5783 (2012.01); G01C 19/5769 (2012.01); G01L 9/00 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/48 (2006.01); H01L 25/16 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 41/1132 (2013.01); B81B 7/008 (2013.01); B81C 1/00238 (2013.01); G01C 19/5769 (2013.01); G01C 19/5783 (2013.01); G01L 9/0073 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 25/162 (2013.01); H01L 41/0474 (2013.01); H01L 41/0533 (2013.01); H01L 41/113 (2013.01); H01L 41/1138 (2013.01); B81B 2201/02 (2013.01); B81B 2207/012 (2013.01);
Abstract

A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other.


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