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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9666776 B1

PDFFull Text
Date of Patent:
May. 30, 2017

Filed:

Oct. 14, 2014

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

Applicant:

Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;

Inventor:

Toshiyuki Takada, Kashihara, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Osaka, JP;

Attorney:

Nixon & Vanderhye P.C.

Primary Examiner:

Daniel Whalen

Assistant Examiner:

Suberr Chi

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01); H01L 33/52 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/97 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/641 (2013.01); H01L 33/647 (2013.01); H01L 33/52 (2013.01); H01L 33/60 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.

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