The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Jul. 26, 2013
Applicant:

Flisom Ag, Duebendorf, CH;

Inventors:

Dominik Rudmann, Basel, CH;

Marc Kaelin, Zurich, CH;

Thomas Studer, Dhahran, SA;

Felix Budde, Zurich, CH;

Assignee:

FLISOM AG, Duebendorf, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/52 (2006.01); C23C 14/54 (2006.01); H01L 31/18 (2006.01); C23C 14/06 (2006.01); H01L 31/032 (2006.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); C23C 14/0623 (2013.01); C23C 14/545 (2013.01); C23C 14/548 (2013.01); H01L 31/0322 (2013.01); H01L 31/1844 (2013.01); Y02E 10/541 (2013.01); Y02E 10/544 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method for manufacturing a compound film comprising a substrate and at least one additional layer is disclosed. The method comprising the steps of depositing at least two chemical elements on the substrate and/or on the at least one additional layer using depositions sources, maintaining depositing of the at least two chemical elements while the substrate and the deposition sources are being moved relative to each other, measuring the compound film properties, particularly being compound film thickness, compound-film overall composition, and compound-film composition in one or several positions of the compound film, comparing the predefined values for the compound film properties to the measured compound film properties, and adjusting the deposition of the at least two chemical elements in case the measured compound film properties do not match the predefined compound film properties.


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