The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Feb. 26, 2016
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Tetsuya Kimura, Fuchu, JP;
Koki Takami, Sagamihara, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 27/14683 (2013.01);
Abstract
Provided is a method of manufacturing an electronic device, including: forming a first electrode over a substrate forming a first insulating layer over the first electrode; forming a second electrode over the first insulating layer; forming a second insulating layer over the second electrode; and polishing a surface of the second insulating layer by CMP, in which an end portion of the second electrode that is closest to a rim of the substrate is formed at a location closer to the rim of the substrate than an end portion of the first electrode that is closest to the rim of the substrate is.