The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Jul. 04, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seol Young Choi, Yongin-si, KR;

Sung Soo Park, Suwon-si, KR;

Shinya Ishizaki, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/065 (2006.01); H01L 33/08 (2010.01); H01L 33/20 (2010.01); H01L 33/54 (2010.01); H01L 33/32 (2010.01); H01L 33/06 (2010.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 33/06 (2013.01); H01L 33/08 (2013.01); H01L 33/20 (2013.01); H01L 33/32 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 27/156 (2013.01);
Abstract

Alight emitting device package may include a printed circuit board and a plurality of light emitting devices mounted on the printed circuit board, wherein a first light emitting device of the plurality of light emitting devices may comprise first to fourth conductor pads formed discretely on the bottom surface of the light emitting device, the printed circuit board comprises first to fourth conductor patterns formed discretely on the top surface of the printed circuit board, and the first to fourth conductor patterns are connected to respective first to fourth conductor pads by respective first to fourth solders.


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