The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Apr. 17, 2015
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Saverio Trotta, Munich, DE;

Jagjit Singh Bal, Ottobrunn, DE;

Ulrich Moeller, Holzkirchen, DE;

Andrzej Samulak, Lindau, DE;

Werner Simbuerger, Haar, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3675 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H01L 2023/4087 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/16225 (2013.01);
Abstract

An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.


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