The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Sep. 24, 2014
Applicant:

Nec Corporation, Tokyo, JP;

Inventor:

Junichi Tsuchida, Tokyo, JP;

Assignee:

NEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/64 (2013.01); H01L 23/66 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A wiring substrate is provided with a support substrate (), an insulating layer (), and a wiring layer (). The support substrate () is formed with a hole () including an opening portion in one surface of the support substrate (). The insulating layer () is formed on a surface of the support substrate () opposite to the one surface thereof including the opening portion. The wiring layer () includes a wiring pattern of a predetermined structure on the insulating layer (). Further, an orthographic projection to be obtained when the wiring pattern is projected on a predetermined surface of the support substrate (), and an orthographic projection to be obtained when the hole () is projected on the predetermined surface of the support substrate () include a shared portion.


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