The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Apr. 28, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Simon Y S Chang, Plano, TX (US);

Arnold C. Conway, Garland, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Methods and apparatus for front-to-back alignment using narrow scribe lines are disclosed. An apparatus is disclosed that includes a semiconductor wafer comprising a plurality of areas for the fabrication of integrated circuit devices on a device side, the integrated circuit devices arranged in rows and columns and spaced from one another by a plurality of scribe lines disposed on the semiconductor wafer in areas between the integrated circuit devices and free from integrated circuit devices; and one or more alignment marks disposed on the semiconductor wafer, the alignment marks positioned in an intersection of two of the scribe lines; wherein the scribe lines have a first minimum dimension and the one or more alignment marks have a second minimum dimension that is greater than the first minimum dimension. Methods and additional apparatus are disclosed.


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