The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Nov. 05, 2015
Applicant:

Hyun-min Choi, Uiwang-si, KR;

Inventor:

Hyun-Min Choi, Uiwang-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); G11C 29/00 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 27/112 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); G11C 29/785 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/11206 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Provided is an e-fuse structure of a semiconductor device having improved fusing performance so as to enable a program operation at a low voltage. The e-fuse structure includes a first metal pattern formed at a first vertical level, the first metal pattern including a first part extending in a first direction and a second part extending in the first direction and positioned to be adjacent to the first part, and a third part adjacent to the second part, the second part being positioned between the first part and the third part, the first part and the second part being electrically connected to each other, and the third part being electrically disconnected from the second part; and a second metal pattern electrically connected to the first metal pattern and formed at a second vertical level different from the first vertical level.


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