The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Jan. 05, 2016
Applicant:

New Japan Radio Co., Ltd., Chuo-ku, Tokyo, JP;

Inventors:

Yuya Ohashi, Tokyo, JP;

Jun Yamashita, Tokyo, JP;

Yoshio Fujii, Tokyo, JP;

Kohei Shirokura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/495 (2006.01); H03K 19/00 (2006.01); H03K 19/003 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49517 (2013.01); H01L 23/49551 (2013.01); H01L 23/49558 (2013.01); H01L 23/49575 (2013.01); H03K 19/00 (2013.01); H03K 19/00346 (2013.01); H01L 23/3107 (2013.01); H01L 23/5228 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/181 (2013.01);
Abstract

One embodiment provides a semiconductor device having a first chip for lowering an input voltage and a second chip for performing signal processing, mounted on a die pad. Lead terminals are divided into a first lead row and a second lead row. The first lead row are connected with the first chip, the first chip are connected with the second chip or the second lead row, and the second chip are connected with the second lead row. A distance between the lead terminals of the first lead row is set longer than a distance between the lead terminals of the second lead row, and a sealing resin is provided to fill at least between the lead terminals of the first lead row.


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