The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Jun. 02, 2015
Applicant:

Rf Micro Devices, Inc., Greensboro, NC (US);

Inventor:

Robert Charles Dry, Oak Ridge, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/5383 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01);
Abstract

The present disclosure relates to a ring-frame power package. The ring-frame power package includes a thermal carrier and a ring structure. The thermal carrier has a carrier surface. The ring structure is disposed over the carrier surface of the thermal carrier so that a portion of the carrier surface is exposed through an interior opening of the ring body. The ring structure also includes one or more interconnect tabs that extend outward from an outer periphery of the ring body. Each interconnect tab includes a top plated area that covers at least a portion of a top surface and a bottom plated area that covers at least a bottom surface of the respective interconnect tab. Notably, each top plated area also covers a contact portion of the ring body that is adjacent to the respective interconnect tab. Each top plated area is electrically coupled to the corresponding bottom plated area.


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