The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Feb. 19, 2016
Applicants:

Thomas Oszinda, Hwaseong-si, KR;

Tae-jin Yim, Yongin-si, KR;

Sang-hoon Ahn, Goyang-si, KR;

Nae-in Lee, Seoul, KR;

Inventors:

Thomas Oszinda, Hwaseong-si, KR;

Tae-Jin Yim, Yongin-si, KR;

Sang-Hoon Ahn, Goyang-si, KR;

Nae-In Lee, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76831 (2013.01); H01L 21/76825 (2013.01);
Abstract

In a method of forming a wiring structure, an insulating interlayer is formed on a substrate. The insulating interlayer includes an opening and has pores distributed therein and exposed at a surface thereof. The insulating interlayer is exposed to a silane compound to form a pore sealing layer on the surface of the insulating interlayer and a sidewall of the opening. A conductive pattern filling the opening is formed on the pore sealing layer.


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