The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
May. 16, 2014
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Shinjiro Watari, Hitachinaka, JP;
Shuichi Kokubun, Hitachinaka, JP;
Takeshi Yamada, Hitachinaka, JP;
Tsuyoshi Harada, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module () is provided with a substrate (), relay terminals (), external connecting terminals () and a relay terminal holding member (). The relay terminals () are connected to the substrate () with a solder () therebetween. The external connecting terminals () are bonded to the relay terminals (), respectively. The non-conductive relay terminal holding member () holds end portions of the relay terminals () said end portions being on the side bonded to the solder ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile