The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Mar. 29, 2016
SK Hynix Inc., Gyeonggi-do, KR;
Hyun-Bae Lee, Gyeonggi-do, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A multi-chip package (MCP) includes semiconductor chips integrated therein. Each semiconductor chip includes: pad groups which extend in a first direction and are arranged in a second direction, and each of which includes a first metal line and a second metal line that are stacked in a third direction with an interlayer dielectric layer interposed therebetween; receivers which one-to-one correspond to the respective pad groups, and each of which includes a first input terminal coupled with the first metal line of a corresponding pad group, and an output terminal coupled with the second metal line of the corresponding pad group; and selectors, each of which selects one of a feedback signal transferred from the output terminal of a corresponding receiver and a reference voltage, and provides the selected one to a second input terminal of the corresponding receiver, in response to a chip select signal.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile