The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Sep. 12, 2013
Applicant:
Mitsubishi Engineering-plastics Corporation, Tokyo, JP;
Inventors:
Atsushi Motegi, Hiratsuka, JP;
Hiroyoshi Maruyama, Hiratsuka, JP;
Assignee:
MITSUBISHI ENGINEERING-PLASTICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 63/02 (2006.01); C08L 69/00 (2006.01); C08K 13/04 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/38 (2006.01);
U.S. Cl.
CPC ...
C08L 69/00 (2013.01); C08K 13/04 (2013.01); C23C 18/1641 (2013.01); C23C 18/204 (2013.01); C23C 18/38 (2013.01); C08L 2203/20 (2013.01); C08L 2205/06 (2013.01); Y10T 428/31507 (2015.04);
Abstract
Provided is a resin composition capable of achieving a higher plating property. The resin composition comprises, relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass filler and 2 to 20 parts by weight of a laser direct structuring additive,