The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Jan. 21, 2013
Matsumoto Yushi-seiyaku Co., Ltd., Yao-shi, Osaka, JP;
Naoya Tayagaki, Yao, JP;
Yasuyuki Nomura, Yao, JP;
MATSUMOTO YUSHI-SEIYAKU CO., LTD., Osaka, JP;
Abstract
Heat-expandable microspheres with high encapsulation efficiency of a blowing agent and good heat-expansion performance, a process for reproducibly producing the heat-expandable microspheres and application thereof are provided. The heat-expandable microspheres comprise essentially a thermoplastic resin shell and a blowing agent encapsulated therein, and contain not more than 500 ppm of silicon, not more than 350 ppm of aluminum and not more than 600 ppm of the total of the silicon and aluminum. The heat-expandable microspheres retain at least 70% of the blowing agent encapsulated therein at the temperature which is the average of their expansion-initiation temperature and maximum expansion temperature.