The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

May. 28, 2010
Applicants:

Masakatsu Ikisawa, Ibaraki, JP;

Masataka Yahagi, Ibaraki, JP;

Kozo Osada, Ibaraki, JP;

Takashi Kakeno, Ibaraki, JP;

Hideo Takami, Ibaraki, JP;

Inventors:

Masakatsu Ikisawa, Ibaraki, JP;

Masataka Yahagi, Ibaraki, JP;

Kozo Osada, Ibaraki, JP;

Takashi Kakeno, Ibaraki, JP;

Hideo Takami, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/453 (2006.01); C01G 15/00 (2006.01); C04B 35/626 (2006.01); C23C 14/08 (2006.01); C23C 14/34 (2006.01); H01B 1/08 (2006.01);
U.S. Cl.
CPC ...
C04B 35/453 (2013.01); C01G 15/006 (2013.01); C04B 35/6261 (2013.01); C04B 35/62655 (2013.01); C04B 35/62675 (2013.01); C23C 14/086 (2013.01); C23C 14/3414 (2013.01); C01P 2006/12 (2013.01); C01P 2006/40 (2013.01); C01P 2006/80 (2013.01); C04B 2235/3284 (2013.01); C04B 2235/3286 (2013.01); C04B 2235/5409 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/604 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6585 (2013.01); C04B 2235/724 (2013.01); C04B 2235/77 (2013.01); H01B 1/08 (2013.01);
Abstract

An oxide sintered compact made of indium (In), gallium (Ga), zinc (Zn) and oxygen (O) and represented by a formula of InxGayZnzOa [wherein x/(x+y) is 0.2 to 0.8, z/(x+y+z) is 0.1 to 0.5, and a=(3/2)x+(3/2)y+z], wherein the concentration of volatile impurities contained in the oxide sintered compact is 20 ppm or less. Provided is technology for application to the production of an IGZO target capable of achieving high densification and low bulk resistance of the sputtering target, preventing swelling and cracks of the target during the production process, minimizing the generation of nodules, inhibiting abnormal discharge, and enabling DC sputtering.


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