The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2017

Filed:

Jun. 13, 2007
Applicants:

Sebastiaan Bernardus Damman, Leiden, NL;

Johannes Schut, Alphen Aan Den Rijn, NL;

Inventors:

Sebastiaan Bernardus Damman, Leiden, NL;

Johannes Schut, Alphen Aan Den Rijn, NL;

Assignee:

Avery Dennison Corporation, Glendale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); B32B 7/12 (2006.01); B32B 27/32 (2006.01); C09J 7/02 (2006.01); B29C 55/00 (2006.01); B29C 55/06 (2006.01); B29C 55/02 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B29C 55/023 (2013.01); B29C 55/06 (2013.01); B32B 7/12 (2013.01); C08J 5/18 (2013.01); C09J 7/0275 (2013.01); B29K 2023/06 (2013.01); B29K 2023/0641 (2013.01); B29K 2023/12 (2013.01); B32B 2307/514 (2013.01); C08J 2323/02 (2013.01); C09J 7/0207 (2013.01); C09J 2201/622 (2013.01); C09J 2203/334 (2013.01); Y10T 428/1452 (2015.01);
Abstract

Die-cuttable and printable adhesive containing labelstocks for use in preparing die cut adhesive labels, and methods of preparing the labelstocks and die cut labels are described. The labelstocks comprise extruded machine direction oriented monolayer or multilayer films and an adhesive layer. The monolayer films comprise a mixture of about 25% to 80% by weight of a propylene polymer or copolymer, and from about 20% to about 75% by weight of a polyethylene. The films are stretch oriented in the machine direction at a temperature at about or above the melting temperature of the polyethylenes.


Find Patent Forward Citations

Loading…