The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Mar. 03, 2017
Showa Denko Packaging Co., Ltd., Isehara-shi, Kanagawa, JP;
Tetsunobu Kuramoto, Isehara, JP;
Yuji Minamibori, Isehara, JP;
SHOWA DENKO PACKAGING CO., LTD., Kanagawa, JP;
Abstract
Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and has superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer () comprising a heat-resistant resin; an inside sealant layer () comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (). In the heat-resistant resin of the outside substrate layer (), a biaxially oriented polyethyleneterephthalate film is used that, when the tensile breaking strength in the M direction is MB and the tensile breaking strength in the T direction is TB, the following are satisfied: formula (I) 500 MPa=MB+TB=700 MPa; and formula (II) ¦MB−TB¦=30 MPa.