The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Nov. 20, 2012
Applicant:
Uacj Corporation, Tokyo, JP;
Inventors:
Assignee:
UACJ Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); B23K 37/04 (2006.01); B23K 31/00 (2006.01); B23K 31/02 (2006.01); B23K 20/02 (2006.01); B21D 26/023 (2011.01); B21D 26/055 (2011.01); B23K 20/16 (2006.01); B23K 1/20 (2006.01); B23K 20/00 (2006.01); B21D 26/021 (2011.01); B23K 20/24 (2006.01); B23K 20/14 (2006.01); B23K 20/233 (2006.01); B21D 37/16 (2006.01); B23K 101/04 (2006.01); B23K 103/10 (2006.01); B23K 103/14 (2006.01);
U.S. Cl.
CPC ...
B23K 20/023 (2013.01); B21D 26/021 (2013.01); B21D 26/023 (2013.01); B21D 26/055 (2013.01); B21D 37/16 (2013.01); B23K 1/203 (2013.01); B23K 20/008 (2013.01); B23K 20/14 (2013.01); B23K 20/16 (2013.01); B23K 20/233 (2013.01); B23K 20/2333 (2013.01); B23K 20/2336 (2013.01); B23K 20/24 (2013.01); B23K 2201/04 (2013.01); B23K 2203/10 (2013.01); B23K 2203/14 (2013.01); Y10T 403/478 (2015.01);
Abstract
The metal forming method includes deforming a member to be formed () that includes a second metal and that has been heated and bringing the member into contact with a member to be bonded () that includes a first metal and that has been heated, in which the temperature of the member to be bonded () is a temperature at which a liquid phase percentage in the member to be bonded () is from 5 to 35%.