The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Feb. 19, 2014
Applicant:
C.r. Bard, Inc., Covington, GA (US);
Inventors:
Assignee:
C. R. Bard, Inc., Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61L 31/08 (2006.01); A61L 27/34 (2006.01); A61L 27/54 (2006.01); A61L 29/08 (2006.01); A61L 29/16 (2006.01); A61L 31/10 (2006.01); A61L 31/16 (2006.01); B05D 7/02 (2006.01); A61L 29/10 (2006.01); A61M 25/00 (2006.01); C23C 18/18 (2006.01); C23C 18/20 (2006.01); C23C 18/42 (2006.01); B05D 5/06 (2006.01);
U.S. Cl.
CPC ...
A61L 31/088 (2013.01); A61L 27/34 (2013.01); A61L 27/54 (2013.01); A61L 29/085 (2013.01); A61L 29/106 (2013.01); A61L 29/16 (2013.01); A61L 31/10 (2013.01); A61L 31/16 (2013.01); A61M 25/0017 (2013.01); B05D 7/02 (2013.01); C23C 18/1882 (2013.01); C23C 18/1893 (2013.01); C23C 18/2066 (2013.01); C23C 18/2086 (2013.01); C23C 18/42 (2013.01); A61L 2300/104 (2013.01); A61L 2300/404 (2013.01); B05D 5/067 (2013.01); Y10T 428/31692 (2015.04); Y10T 428/31707 (2015.04);
Abstract
Methods for the deposition of silver-comprising films on nonconducting substrates, and, more particularly, to deposition of such films that are very thin, are provided. The surface of nonconducting substrates is modified with a superabsorbent polymer to increase silver deposition when compared to a non-modified surface. Also provided are films produced using a swelling agent, whereby porosity of the surface of the nonconducting substrate is increased, thereby permitting increased silver deposition when compared to an unmodified surface.