The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Nov. 15, 2013
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Katsuhiko Itoh, Yamanashi, JP;

Mitsuo Nakamura, Yamanashi, JP;

Daisuke Nagai, Yamanashi, JP;

Kenji Okamoto, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H05K 13/00 (2006.01); H05K 13/08 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 31/12 (2006.01); B23K 37/04 (2006.01); H05K 3/34 (2006.01); B23K 1/008 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); H05K 13/04 (2006.01); H05K 3/30 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0015 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 3/0638 (2013.01); B23K 3/087 (2013.01); B23K 31/12 (2013.01); B23K 37/04 (2013.01); H05K 3/34 (2013.01); H05K 13/0465 (2013.01); H05K 13/08 (2013.01); B23K 2201/42 (2013.01); H05K 3/303 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/04 (2013.01); H05K 2203/163 (2013.01); H05K 2203/166 (2013.01); Y02P 70/611 (2015.11);
Abstract

In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.


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