The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Oct. 25, 2013
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Yoshinori Wakana, Hitachinaka, JP;
Masaru Kamoshida, Hitachinaka, JP;
Yasuro Kameshiro, Hitachinaka, JP;
Takashi Hattori, Hitachinaka, JP;
Takashi Igarashi, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
The invention provides an electronic control device having a high-grade heat sink that: does not require tight control at the time of manufacturing; does not restrict the range of electronic components that can be used; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit boardhaving an electronic componentthereon is placed in a non-metal (resin) housing having: a housing baseintegrally comprising via a partition walla connector inserting sectionused for electrical connection with an external mating connector (not illustrated); and a housing coverattached to the housing base, part of the boardis inserted into an insertion hole provided in the partition wallso that it is exposed inside the connector inserting section. A pair of elastic metal parts, a heat sink, is provided in the housing, connected to the circuit boardat particular positions on its top and bottom surfaces with the use of a connecting material(solder or adhesive), and has an arch-shaped cross section as viewed from a lateral direction. The heat of the componentis transferred to the housing to dissipate it to the outside by the boardbeing supported from the top and bottom sides in the housing.