The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Feb. 25, 2013
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Ji Su Kim, Seoul, KR;

Ki Do Chun, Seoul, KR;

Kyu Won Lee, Seoul, KR;

Sang Myung Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4602 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/107 (2013.01); H05K 3/465 (2013.01); H05K 3/4697 (2013.01); H05K 2201/017 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/20 (2013.01);
Abstract

Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.


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