The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Dec. 01, 2016
Applicant:

Harris Corporation, Melbourne, FL (US);

Inventors:

Gregory M. Jandzio, Melbourne, FL (US);

Brinnan C. Riley, West Melbourne, FL (US);

Charlie Dull, Palm Bay, FL (US);

Jason Naylor, Palm Bay, FL (US);

Assignee:

Harris Corporation, Melbourne, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/182 (2013.01); H05K 3/34 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/2027 (2013.01);
Abstract

Microclip appliance formed from a single conductive planar metal sheet includes portions defined along an elongated length including a pin receiver, a solder paddle and a bridge. The pin receiver includes first and second planar rings, and a spring bar extending from a periphery of the first ring to a periphery of the second ring. The solder paddle is comprised of a portion of the conductive metal sheet distal from the pin receiver and the bridge extends from a peripheral portion of the solder paddle to the second ring. Lateral bends are disposed along a length of the conductive planar metal sheet to facilitate the various portions of the microclip.


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