The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Nov. 30, 2012
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Yun Kyoung Jo, Seoul, KR;
Seol Hee Lim, Seoul, KR;
Chang Hwa Park, Seoul, KR;
Sai Ran Eom, Seoul, KR;
Ae Rim Kim, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); H05K 3/182 (2013.01); H05K 3/188 (2013.01); H05K 3/244 (2013.01); H05K 2201/0341 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09436 (2013.01); Y10T 29/49155 (2015.01);
Abstract
Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.