The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Nov. 29, 2012
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Hiroharu Inoue, Osaka, JP;

Koji Kishino, Fukushima, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); B32B 7/02 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); B32B 5/02 (2006.01); B32B 15/12 (2006.01); B32B 15/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 7/02 (2013.01); B32B 15/12 (2013.01); B32B 15/14 (2013.01); H05K 1/00 (2013.01); H05K 3/022 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/028 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/10 (2013.01); B32B 2307/30 (2013.01); B32B 2307/306 (2013.01); B32B 2457/08 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0275 (2013.01); H05K 2201/068 (2013.01); Y10T 428/24942 (2015.01);
Abstract

A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.


Find Patent Forward Citations

Loading…