The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Jul. 07, 2016
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventors:
Russ Alan Reisner, Oxnard, CA (US);
John C. Baldwin, Tarzana, CA (US);
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H03H 9/05 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H03H 9/46 (2006.01); H04B 1/04 (2006.01); H04B 1/16 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0566 (2013.01); H01L 23/3114 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H03H 9/46 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06555 (2013.01); H04B 1/04 (2013.01); H04B 1/16 (2013.01);
Abstract
Devices and method related to stacked duplexers. In some embodiments, an assembly may include a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield. The assembly may also include a second WLP device having an RF shield, the second WLP device positioned over the first WLP device such that the RF shield of the second WLP device is electrically connected to the RF shield of the first WLP device.