The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Apr. 28, 2014
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Aleksey A. Lyalin, Thousand Oaks, CA (US);

Weimin Sun, Santa Rosa Valley, CA (US);

Nicholas Quinn Muhlmeyer, North Hills, CA (US);

Russ Alan Reisner, Newbury Park, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03F 3/191 (2006.01); H03H 7/38 (2006.01); H01F 27/28 (2006.01); H01F 41/02 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H01L 23/66 (2006.01); H03H 7/01 (2006.01); H03H 1/00 (2006.01); H01F 30/02 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H03H 7/38 (2013.01); H01F 27/2804 (2013.01); H01F 41/02 (2013.01); H01L 23/66 (2013.01); H03F 1/565 (2013.01); H03F 3/191 (2013.01); H03F 3/195 (2013.01); H01F 30/02 (2013.01); H01F 2027/2809 (2013.01); H01L 28/10 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/49171 (2013.01); H03F 2200/387 (2013.01); H03F 2200/391 (2013.01); H03H 7/175 (2013.01); H03H 7/1758 (2013.01); H03H 7/1775 (2013.01); H03H 2001/0064 (2013.01); H03H 2001/0078 (2013.01); Y10T 29/4902 (2015.01);
Abstract

Disclosed are devices and methods related to autotransformer-based impedance matching for radio-frequency (RF) applications. In some embodiments, an impedance matching device can include a primary metal trace and a secondary metal trace, each having a respective number of turns. Such metal traces can be interconnected to form an autotransformer with the primary metal trace and the secondary metal trace being in respective planes separated by a selected distance. Such an autotransformer can be utilized to, for example, facilitate impedance matching of an amplified RF signal from a power amplifier (PA). In some embodiments, the impedance matching device can be implemented as an integrated passive device (IPD) mountable on a packaging substrate. Such an IPD can be configured to allow stacking of another component on the IPD to yield a number of desirable features in products such as RF modules.


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