The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Apr. 14, 2015
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Hardik Bhupendra Modi, Irvine, CA (US);

Sandra Louise Petty-Weeks, Newport Beach, CA (US);

Hongxiao Shao, Thousand Oaks, CA (US);

Weimin Sun, Santa Rosa Valley, CA (US);

Peter J. Zampardi, Jr., Newbury Park, CA (US);

Guohao Zhang, Nanjing, CN;

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/195 (2006.01); H03F 1/02 (2006.01); H03F 3/19 (2006.01); H03F 3/21 (2006.01); H03F 3/24 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 29/36 (2006.01); H01L 29/66 (2006.01); H01L 29/737 (2006.01); H01L 29/812 (2006.01); H01L 29/08 (2006.01); H01L 29/205 (2006.01); H01L 27/06 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H03F 3/60 (2006.01); H03F 3/213 (2006.01); H03F 3/187 (2006.01); H03F 3/347 (2006.01); H01L 29/8605 (2006.01); H01L 21/8252 (2006.01); H01L 27/092 (2006.01); H03F 3/45 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0205 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 27/0605 (2013.01); H01L 27/0623 (2013.01); H01L 29/0821 (2013.01); H01L 29/205 (2013.01); H01L 29/36 (2013.01); H01L 29/66242 (2013.01); H01L 29/7371 (2013.01); H01L 29/812 (2013.01); H03F 3/19 (2013.01); H03F 3/21 (2013.01); H03F 3/245 (2013.01); H03F 3/60 (2013.01); H01L 21/8252 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 27/092 (2013.01); H01L 29/66863 (2013.01); H01L 29/8605 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48611 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48811 (2013.01); H01L 2224/48816 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48864 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85411 (2013.01); H01L 2224/85416 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12033 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30111 (2013.01); H03F 3/187 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H03F 3/347 (2013.01); H03F 3/45 (2013.01); H03F 2200/451 (2013.01);
Abstract

One aspect of this disclosure is a power amplifier module that includes a power amplifier; a wire bond pad electrically connected to the power amplifier, the wire bond pad including a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer; and a conductive trace having a top surface with a plated portion and an unplated portion surrounding the plated portion, the wire bond pad being disposed over the plated portion. Other embodiments of the module are provided along with related methods and components thereof.


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