The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Oct. 31, 2014
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Yawei Liu, Guangdong, CN;

Yifan Wang, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/50 (2006.01); H01L 51/56 (2006.01); C09K 11/02 (2006.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5036 (2013.01); C09K 11/025 (2013.01); H01L 27/3213 (2013.01); H01L 27/3262 (2013.01); H01L 51/001 (2013.01); H01L 51/0035 (2013.01); H01L 51/0037 (2013.01); H01L 51/0061 (2013.01); H01L 51/0067 (2013.01); H01L 51/0072 (2013.01); H01L 51/0081 (2013.01); H01L 51/5056 (2013.01); H01L 51/5072 (2013.01); H01L 51/5246 (2013.01); H01L 51/56 (2013.01); H01L 27/1214 (2013.01); H01L 2227/323 (2013.01);
Abstract

The present invention provides a method for manufacturing an OLED device and an OLED device manufactured therewith. The method for manufacturing an OLED device includes: (1) providing a substrate and forming, in sequence, an anode and a hole transporting layer on the substrate; (2) forming an emissive layer on the hole transporting layer through a solution film casting process, wherein the emissive layer comprises a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel, of which at least one sub-pixel is formed of a quantum dot and at least one sub-pixel is formed of an organic light-emitting material; (3) forming, in sequence, an electron transporting layer and a cathode on the emissive layer; and (4) providing a package cover plate, which is set above the cathode, wherein the substrate and the package cover plate are bonded together by sealing enclosing resin to complete packaging of the OLED device. Since each sub-pixel of the emissive layer is formed through a solution film casting process, the manufacture of the OLED device requires no use of a fine metal mask so that the manufacturing cost is low, the utilization rate of material is high, and the yield rate is good.


Find Patent Forward Citations

Loading…