The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Sep. 19, 2013
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Hideo Miyasaka, Okaya, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 41/23 (2013.01); H03H 9/10 (2006.01); B23K 1/00 (2006.01); B23K 1/005 (2006.01); G01C 19/5628 (2012.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
H01L 41/23 (2013.01); B23K 1/005 (2013.01); B23K 1/0016 (2013.01); G01C 19/5628 (2013.01); H03H 9/10 (2013.01); H03H 9/1021 (2013.01); H03H 9/1057 (2013.01); H03H 9/1071 (2013.01); B23K 2201/36 (2013.01); H01L 2924/16195 (2013.01); Y10T 29/42 (2015.01);
Abstract
A method of manufacturing an electronic device including an electronic element, a base substrate, and a lid member, includes joining the lid member to the sealing part by application of an energy beam so that a plate thickness of the lid member may be larger in a part joined to the sealing part than in a part located inside of the part in a plan view along the thickness direction.
Miyasaka, Hideo. (2017). Method of manufacturing electronic device, electronic apparatus, and mobile apparatus (U.S. Patent No. 9660176). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9660176
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile