The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Jul. 14, 2015
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Frederic Stephane Diana, Santa Clara, CA (US);

Yajun Wei, Loveland, OH (US);

Stefano Schiaffino, Pleasanton, CA (US);

Brendan Jude Moran, San Jose, CA (US);

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/12 (2010.01); H01L 33/64 (2010.01); H01L 33/56 (2010.01); H01L 33/48 (2010.01); H01L 33/40 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); H01L 33/12 (2013.01); H01L 33/40 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/644 (2013.01); H01L 33/647 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Elements are added to a light emitting device to reduce the stress within the light emitting device caused by thermal cycling. Alternatively, or additionally, materials are selected for forming contacts within a light emitting device based on their coefficient of thermal expansion and their relative cost, copper alloys being less expensive than gold, and providing a lower coefficient of thermal expansion than copper. Elements of the light emitting device may also be structured to distribute the stress during thermal cycling.


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