The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

May. 20, 2011
Applicants:

David Todd Emerson, Chapel Hill, NC (US);

Raymond Rosado, Apex, NC (US);

Matthew Donofrio, Raleigh, NC (US);

John Adam Edmond, Durham, NC (US);

Inventors:

David Todd Emerson, Chapel Hill, NC (US);

Raymond Rosado, Apex, NC (US);

Matthew Donofrio, Raleigh, NC (US);

John Adam Edmond, Durham, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/52 (2010.01); H01L 33/20 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 33/20 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely spaced apart anode and cathode pads of the substrate. An encapsulant is provided on the light emitting diode die and the mounting substrate. The gap is configured to prevent sufficient encapsulant from entering the gap that would degrade operation of the LED.


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