The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9660111 B1

PDF
Full Text
Expired
Date of Patent:
May. 23, 2017

Filed:

Jan. 22, 2014
Applicant:

Omnipv, Inc., Menlo Park, CA (US);

Inventors:

Nemanja Vockic, San Jose, CA (US);

Jian Jim Wang, Orefield, PA (US);

William Pfenninger, Fremont, CA (US);

John Kenney, Palo Alto, CA (US);

Assignee:

OMNIPV, INC., Menlo Park, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/24 (2006.01); H01L 31/0232 (2014.01); C23C 12/02 (2006.01); C23C 14/30 (2006.01); C23C 14/02 (2006.01); C23C 14/00 (2006.01); C23C 14/06 (2006.01); C23C 14/58 (2006.01); H01L 31/055 (2014.01); C09K 11/61 (2006.01); C09K 11/66 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02322 (2013.01); C09K 11/616 (2013.01); C09K 11/665 (2013.01); C23C 12/02 (2013.01); C23C 14/0026 (2013.01); C23C 14/024 (2013.01); C23C 14/025 (2013.01); C23C 14/0694 (2013.01); C23C 14/24 (2013.01); C23C 14/30 (2013.01); C23C 14/5806 (2013.01); H01L 31/055 (2013.01); Y02E 10/52 (2013.01);
Abstract

Luminescent materials and methods of forming such materials are described herein. A method of forming a luminescent material includes: (1) providing a source of A and X, wherein A is selected from at least one of elements of Group 1, and X is selected from at least one of elements of Group 17; (2) providing a source of B, wherein B is selected from at least one of elements of Group 14; (3) subjecting the source of A and X and the source of B to vacuum deposition to form a precursor layer over a substrate; (4) forming an encapsulation layer over the precursor layer to form an assembly of layers; and (5) heating the assembly of layers to a temperature Tto form a luminescent material within the precursor layer.


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