The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Jan. 09, 2014
Applicants:

Kabushiki Kaisha Toyota Chuo Kenkyusho, Nagakute-shi, Aichi-ken, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Denso Corporation, Kariya-shi, Aichi-ken, JP;

Inventors:

Sachiko Aoi, Nagoya, JP;

Yukihiko Watanabe, Nagoya, JP;

Katsumi Suzuki, Nagakute, JP;

Shoji Mizuno, Okazaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/332 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/739 (2006.01); H01L 29/16 (2006.01); H01L 29/417 (2006.01); H01L 29/08 (2006.01); H01L 29/20 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66348 (2013.01); H01L 29/0847 (2013.01); H01L 29/1095 (2013.01); H01L 29/66045 (2013.01); H01L 29/66068 (2013.01); H01L 29/66333 (2013.01); H01L 29/66727 (2013.01); H01L 29/66734 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01); H01L 29/7802 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01); H01L 29/0619 (2013.01); H01L 29/0865 (2013.01); H01L 29/0869 (2013.01); H01L 29/1602 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/41766 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes: forming a first trench in a first area of a drift layer that has a surface including the first area and a second area; growing a crystal of a p-type base layer on a surface of the drift layer after forming the first trench; and growing a crystal of an n-type source layer on a surface of the base layer. Material of the drift layer, the base layer, and the source layer are a wide-gap semiconductor.


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