The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Dec. 15, 2015
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Arno Zechmann, Villach, AT;

Annette Sanger, Villach, AT;

Ulrike Fastner, Villach, AT;

Beate Weissnicht, Villach, AT;

Stefan Krivec, Arnoldstein, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01); H01L 31/0256 (2006.01); H01L 29/20 (2006.01); H01L 31/0304 (2006.01); H01L 21/768 (2006.01); H01L 21/027 (2006.01); H01L 29/66 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 21/0273 (2013.01); H01L 21/2885 (2013.01); H01L 21/76865 (2013.01); H01L 21/76873 (2013.01); H01L 21/76879 (2013.01); H01L 29/66462 (2013.01);
Abstract

In an embodiment, a method includes forming an adhesion promotion layer on at least portions of a conductive surface arranged on a Group III nitride-based semiconductor layer, applying a resist layer to the adhesion promotion layer such that regions of the conductive surface are uncovered by the adhesion promotion layer and the resist layer, applying by electroplating a conductive layer to the regions of the conductive surface uncovered by the adhesion promotion layer and the resist layer, and removing the resist layer and removing the adhesion promotion layer.


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