The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Aug. 05, 2015
Applicant:
Lextar Electronics Corporation, Hsinchu, TW;
Inventors:
Yi-Jyun Chen, Chiayi County, TW;
Chih-Hao Lin, Taipei, TW;
Hsin-Lun Su, Chiayi County, TW;
Fang-Chang Hsueh, Taichung, TW;
Assignee:
Lextar Electronics Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 23/498 (2006.01); H01L 27/15 (2006.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 25/075 (2013.01); H01L 27/15 (2013.01); H01L 27/153 (2013.01); H01L 33/44 (2013.01); H01L 33/502 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01);
Abstract
A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.