The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Feb. 02, 2016
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Hee Min Shin, Seongnam-si, KR;
Mi Young Kim, Gunpo-si, KR;
Assignee:
SK hynix Inc., Icheon-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/495 (2006.01); H01L 51/00 (2006.01); H01L 41/047 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/4985 (2013.01); H01L 23/49572 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 41/0475 (2013.01); H01L 51/0097 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01);
Abstract
A semiconductor package includes a first semiconductor package, a second semiconductor package disposed on the first semiconductor package, and a flexible wing interconnection substrate disposed between the first and second semiconductor packages.